| Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition YS Lai, PF Yang, CL Yeh Microelectronics Reliability 46 (2-4), 645-650, 2006 | 219 | 2006 |
| Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples PF Yang, YS Lai, SR Jian, J Chen, RS Chen Materials Science and Engineering: A 485 (1-2), 305-310, 2008 | 190 | 2008 |
| Thermomigration in SnPb composite flip chip solder joints AT Huang, AM Gusak, KN Tu, YS Lai Applied Physics Letters 88 (14), 2006 | 188 | 2006 |
| Advanced flip chip packaging HM Tong, YS Lai, CP Wong Springer US, 2013 | 158 | 2013 |
| Electromigration reliability and morphologies of Cu pillar flip-chip solder joints with Cu substrate pad metallization YS Lai, YT Chiu, J Chen Journal of Electronic Materials 37, 1624-1630, 2008 | 115 | 2008 |
| Semiconductor package and method for processing and bonding a wire HC Chang, TY Tsai, YS Lai, HM Tong, JC Chen, WC Yih, CY Hung, ... US Patent 8,053,906, 2011 | 109 | 2011 |
| Support excitation scheme for transient analysis of JEDEC board-level drop test CL Yeh, YS Lai Microelectronics Reliability 46 (2-4), 626-636, 2006 | 99 | 2006 |
| Alloying modification of Sn–Ag–Cu solders by manganese and titanium LW Lin, JM Song, YS Lai, YT Chiu, NC Lee, JY Uan Microelectronics Reliability 49 (3), 235-241, 2009 | 94 | 2009 |
| Stress–strain characteristics of tin-based solder alloys for drop-impact modeling EH Wong, CS Selvanayagam, SKW Seah, WD Van Driel, J Caers, ... Journal of Electronic Materials 37, 829-836, 2008 | 91 | 2008 |
| Electromigration of Sn–37Pb and Sn–3Ag–1.5 Cu/Sn–3Ag–0.5 Cu composite flip–chip solder bumps with Ti/Ni (V)/Cu under bump metallurgy YS Lai, KM Chen, CL Kao, CW Lee, YT Chiu Microelectronics Reliability 47 (8), 1273-1279, 2007 | 88 | 2007 |
| Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering PF Yang, HC Wen, SR Jian, YS Lai, S Wu, RS Chen Microelectronics Reliability 48 (3), 389-394, 2008 | 80 | 2008 |
| Advances in the drop-impact reliability of solder joints for mobile applications EH Wong, SKW Seah, WD Van Driel, J Caers, N Owens, YS Lai Microelectronics Reliability 49 (2), 139-149, 2009 | 78 | 2009 |
| Evaluation of board-level reliability of electronic packages under consecutive drops CL Yeh, YS Lai, CL Kao Microelectronics Reliability 46 (7), 1172-1182, 2006 | 75 | 2006 |
| A review of three-dimensional viscoelastic models with an application to viscoelasticity characterization using nanoindentation DL Chen, PF Yang, YS Lai Microelectronics Reliability 52 (3), 541-558, 2012 | 74 | 2012 |
| Atomic-level simulations of nanoindentation-induced phase transformation in mono-crystalline silicon YH Lin, TC Chen, PF Yang, SR Jian, YS Lai Applied Surface Science 254 (5), 1415-1422, 2007 | 74 | 2007 |
| Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof CW Chen, YS Lai, HC Chang, TY Tsai, PHC Chien, PC Hu, HY Lee US Patent 8,115,285, 2012 | 72 | 2012 |
| Influence of annealing temperature on the structural, optical and mechanical properties of ALD-derived ZnO thin films CY Yen, SR Jian, GJ Chen, CM Lin, HY Lee, WC Ke, YY Liao, PF Yang, ... Applied surface science 257 (17), 7900-7905, 2011 | 71 | 2011 |
| Local melting induced by electromigration in flip-chip solder joints CM Tsai, YL Lin, JY Tsai, YS Lai, CR Kao Journal of electronic materials 35, 1005-1009, 2006 | 71 | 2006 |
| Characteristics of current crowding in flip-chip solder bumps YS Lai, CL Kao Microelectronics Reliability 46 (5-6), 915-922, 2006 | 71 | 2006 |
| Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration FY Ouyang, KN Tu, YS Lai, AM Gusak Applied Physics Letters 89 (22), 2006 | 68 | 2006 |
