Yi-Shao Lai
Yi-Shao Lai
ASE Group
Verified email at aseglobal.com - Homepage
Title
Cited by
Cited by
Year
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition
YS Lai, PF Yang, CL Yeh
Microelectronics Reliability 46 (2-4), 645-650, 2006
1982006
Thermomigration in SnPb composite flip chip solder joints
AT Huang, AM Gusak, KN Tu, YS Lai
Applied Physics Letters 88 (14), 141911, 2006
1582006
Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples
PF Yang, YS Lai, SR Jian, J Chen, RS Chen
Materials Science and Engineering: A 485 (1-2), 305-310, 2008
1372008
Semiconductor package and method for processing and bonding a wire
HC Chang, TY Tsai, YS Lai, HM Tong, JC Chen, WC Yih, CY Hung, ...
US Patent 8,053,906, 2011
992011
Support excitation scheme for transient analysis of JEDEC board-level drop test
CL Yeh, YS Lai
Microelectronics Reliability 46 (2-4), 626-636, 2006
882006
Electromigration of Sn–37Pb and Sn–3Ag–1.5 Cu/Sn–3Ag–0.5 Cu composite flip–chip solder bumps with Ti/Ni (V)/Cu under bump metallurgy
YS Lai, KM Chen, CL Kao, CW Lee, YT Chiu
Microelectronics Reliability 47 (8), 1273-1279, 2007
842007
Stress–strain characteristics of tin-based solder alloys for drop-impact modeling
EH Wong, CS Selvanayagam, SKW Seah, WD Van Driel, J Caers, ...
Journal of Electronic Materials 37 (6), 829-836, 2008
822008
Advanced flip chip packaging
HM Tong, YS Lai, CP Wong
Springer US, 2013
792013
Alloying modification of Sn–Ag–Cu solders by manganese and titanium
LW Lin, JM Song, YS Lai, YT Chiu, NC Lee, JY Uan
Microelectronics Reliability 49 (3), 235-241, 2009
752009
Characteristics of current crowding in flip-chip solder bumps
YS Lai, CL Kao
Microelectronics Reliability 46 (5-6), 915-922, 2006
692006
Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering
PF Yang, HC Wen, SR Jian, YS Lai, S Wu, RS Chen
Microelectronics Reliability 48 (3), 389-394, 2008
682008
Evaluation of board-level reliability of electronic packages under consecutive drops
CL Yeh, YS Lai, CL Kao
Microelectronics Reliability 46 (7), 1172-1182, 2006
682006
Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof
CW Chen, YS Lai, HC Chang, TY Tsai, PHC Chien, PC Hu, HY Lee
US Patent 8,115,285, 2012
652012
Advances in the drop-impact reliability of solder joints for mobile applications
EH Wong, SKW Seah, WD Van Driel, J Caers, N Owens, YS Lai
Microelectronics Reliability 49 (2), 139-149, 2009
652009
Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration
FY Ouyang, KN Tu, YS Lai, AM Gusak
Applied Physics Letters 89 (22), 221906, 2006
622006
Evaluation of solder joint strengths under ball impact test
YS Lai, HC Chang, CL Yeh
Microelectronics Reliability 47 (12), 2179-2187, 2007
612007
Electromigration reliability and morphologies of Cu pillar flip-chip solder joints with Cu substrate pad metallization
YS Lai, YT Chiu, J Chen
Journal of Electronic Materials 37 (10), 1624-1630, 2008
572008
Atomic-level simulations of nanoindentation-induced phase transformation in mono-crystalline silicon
YH Lin, TC Chen, PF Yang, SR Jian, YS Lai
Applied Surface Science 254 (5), 1415-1422, 2007
572007
Local melting induced by electromigration in flip-chip solder joints
CM Tsai, YL Lin, JY Tsai, YS Lai, CR Kao
Journal of electronic materials 35 (5), 1005-1009, 2006
572006
Fine pitch copper wire bonding in high volume production
BK Appelt, A Tseng, CH Chen, YS Lai
Microelectronics Reliability 51 (1), 13-20, 2011
562011
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Articles 1–20