| Measurement of stresses in Cu and Si around through-silicon via by synchrotron X-ray microdiffraction for 3-dimensional integrated circuits AS Budiman, HAS Shin, BJ Kim, SH Hwang, HY Son, MS Suh, QH Chung, ... Microelectronics Reliability 52 (3), 530-533, 2012 | 147 | 2012 |
| Microstructure evolution and defect formation in Cu through-silicon vias (TSVs) during thermal annealing HAS Shin, BJ Kim, JH Kim, SH Hwang, AS Budiman, HY Son, KY Byun, ... Journal of Electronic Materials 41, 712-719, 2012 | 79 | 2012 |
| Containment materials for liquid tin at 1350 C as a heat transfer fluid for high temperature concentrated solar power Y Zhang, Y Cai, SH Hwang, G Wilk, F DeAngelis, A Henry, KH Sandhage Solar Energy 164, 47-57, 2018 | 24 | 2018 |
| Electrical and mechanical properties of through-silicon vias and bonding layers in stacked wafers for 3D integrated circuits SH Hwang, BJ Kim, HY Lee, YC Joo Journal of electronic materials 41, 232-240, 2012 | 24 | 2012 |
| Towards the low-dose characterization of beam sensitive nanostructures via implementation of sparse image acquisition in scanning transmission electron microscopy S Hwang, CW Han, SV Venkatakrishnan, CA Bouman, V Ortalan Measurement Science and Technology 28 (4), 045402, 2017 | 22 | 2017 |
| Relationship between tensile characteristics and Fatigue failure by folding or bending in Cu foil on flexible substrate BJ Kim, MH Jeong, SH Hwang, HY Lee, SW Lee, KD Cbun, YB Park, ... Journal of the Microelectronics and Packaging Society 18 (1), 55-59, 2011 | 14 | 2011 |
| Thermo-Mechanical Analysis of Though-silicon-via in 3D Packaging SH Hwang, BJ Kim, SY Jung, HY Lee, YC Joo Journal of the Microelectronics and Packaging Society 17 (1), 69-73, 2010 | 13 | 2010 |
| Tunable multimodal adhesion of 3D, nanocrystalline CoFe2O4 pollen replicas WB Goodwin, D Shin, D Sabo, S Hwang, ZJ Zhang, JC Meredith, ... Bioinspiration & biomimetics 12 (6), 066009, 2017 | 12 | 2017 |
| Comparison of mechanical stresses of Cu Through-Silicon Via (TSV) samples fabricated by Hynix vs. SEMATECH using synchrotron X-ray microdiffraction for 3-D integration and … AS Budiman, H Shin, BJ Kim, SH Hwang, HY Son, MS Suh, QH Chung, ... 2012 IEEE International Interconnect Technology Conference, 1-3, 2012 | 7 | 2012 |
| Kinetic mechanism of conformal magnesium silicide (Mg2Si) film formation via reaction of Si single crystals with Mg vapor J Li, SH Hwang, G Itskos, KH Sandhage Journal of materials science 55, 1107-1116, 2020 | 3 | 2020 |
| Fracture behavior of a melt-infiltration-processed SiC/Si composite at 900° C in argon, air, and steam GD Scofield, S Hwang, M Caccia, AL Chamberlain, MT Kush, MD Sangid, ... Journal of the European Ceramic Society 43 (2), 224-234, 2023 | 2 | 2023 |
| Tailoring of TiAl6V4 surface nanostructure for enhanced In vitro osteoblast response via gas/solid (non-line-of-sight) oxidation/reduction reactions N Ogura, MB Berger, P Srivas, S Hwang, J Li, DJ Cohen, Z Schwartz, ... Biomimetics 7 (3), 117, 2022 | 2 | 2022 |
| Corrosion of a dense, co-continuous SiC/Si composite in CO2 and synthetic air at 750° C TD Nguyen, GD Scofield, S Hwang, MD Sangid, G Itskos, M Caccia, ... Journal of Materials Research and Technology 15, 4852-4859, 2021 | 1 | 2021 |
| Future Trends in Microelectronics: Journey into the Unknown S Hwang, J Heo, MH Lee, KE Byun, Y Cho, S Park, S Luryi, J Xu, ... IEEE Press, Willey, 2016 | 1 | 2016 |
| Implementation of Sparse Image Acquisition in a Conventional Scanning Transmission Electron Microscope M Tanner, S Hwang, V Ortalan, CW Han, SV Venkatakrishnan, ... Microscopy and Microanalysis 23 (S1), 152-153, 2017 | | 2017 |
| Plasticity and Reliability: From Unexpected Plasticity-Induced Damages in Advanced Cu Interconnects to Novel Reliability Phenomena in 3-D Interconnect Schemes Using Through … A Budiman, R Morusupalli, TK Lee, YL Shen, SH Hwang, BJ Kim, HY Son, ... Minerals, Metals and Materials Society/AIME, 420 Commonwealth Dr., P. O. Box …, 2011 | | 2011 |
