| Nondestructive strength diagnostics of solder joints on printed circuit boards I Kovtun, J Boiko, S Petrashchuk 2017 International conference on information and telecommunication …, 2017 | 31 | 2017 |
| Effects of the strain transmission from the main board to the installed electronic components І Kovtun, J Boiko, S Petrashchuk, G Baurienė, K Pilkauskas Kaunas university of technology, 2016 | 31 | 2016 |
| Methodology for assessing synchronization conditions in telecommunication devices J Boiko, I Pyatin, O Eromenko, O Barabash Advances in Science, Technology and Engineering Systems Journal 5 (2), 320-327, 2020 | 29 | 2020 |
| Theory and practice of vibration analysis in electronic packages I Kovtun, J Boiko, S Petrashchuk, T Kałaczyński MATEC Web of Conferences 182, 02015, 2018 | 25 | 2018 |
| Productivity of telecommunication systems with modified signal-code constructions J Boiko, I Kovtun, S Petrashchuk 2017 4th International Scientific-Practical Conference Problems of …, 2017 | 24 | 2017 |
| Quality assessment of synchronization devices in telecommunication J Boiko, O Eromenko, I Kovtun, S Petrashchuk 2019 IEEE 39th International Conference on Electronics and Nanotechnology …, 2019 | 20 | 2019 |
| Vibration transmission in electronic packages having structurally complex design J Boiko, I Kovtun, S Petrashchuk 2017 IEEE First Ukraine Conference on Electrical and Computer Engineering …, 2017 | 18 | 2017 |
| Основы теории аппроксимации оптических сигналов гауссовыми импульсами НА Одегов, ІІ Ковтун, СВ Петращук, РА Тертичний Вісник Хмельницького національного університету. Технічні науки, 42-72, 2018 | 15 | 2018 |
| Mathematical model for dynamic force analysis of printed circuit boards II Kovtun, JM Boiko, SA Petrashchuk Journal of Physics: Conference Series 1921 (1), 012120, 2021 | 9 | 2021 |
| Reliability improvement of printed circuit boards by designing methods for solder joint technical diagnostics with application of acoustic emission method II Kovtun, JM Boiko, SA Petrashchuk Вісник Національного технічного університету України Київський політехнічний …, 2019 | 9 | 2019 |
| Acoustic emission application for nondestructive strength diagnostics of printed circuit boards I Kovtun, J Boiko, S Petrashchuk Хмельницький національний університет, 2018 | 8 | 2018 |
| Assessing Enclosure Case Design on Excitation and Transmission of Vibration in Electronic Packages I Kovtun, J Boiko, S Petrashchuk 2019 IEEE 2nd Ukraine Conference on Electrical and Computer Engineering …, 2019 | 7 | 2019 |
| Identification of natural frequency and form of oscillation for electronic packages subjected to vibration I Kovtun, J Boiko, S Petrashchuk 2018 IEEE 38th International Conference on Electronics and Nanotechnology …, 2018 | 7 | 2018 |
| Exploitation aspects of diagnostic hydraulic and pneumatic systems of Multimedia Hybrid Mobile Stages T Kałaczyński, V Martynyuk, J Boiko, S Matyukh, S Petrashchuk MATEC Web of Conferences 332, 01022, 2021 | 6 | 2021 |
| Methods for Vibration Reduction in Enclosed Electronic Packages I Kovtun, J Boiko, S Petrashchuk, T Kałaczyński MATEC Web of Conferences 302, 01008, 2019 | 6 | 2019 |
| Effectiveness Improvement Method for Signal Processing in Optical Telecommunication J Boiko, O Eromenko, I Kovtun, S Petrashchuk 2018 International Scientific-Practical Conference Problems of …, 2018 | 6 | 2018 |
| Calculation of mechanical stresses in adjoint system of electronic component and compound and strength assessment V Royzman, S Petrashchuk, I Kovtun, A Lokoshchenko Journal of Vibroengineering 15 (1), 65-71, 2013 | 5 | 2013 |
| Nondestructive hermetic seal diagnostics and prediction method for super-high-frequency modules I Kovtun, J Boiko, S Petrashchuk 2018 14th International Conference on Advanced Trends in Radioelecrtronics …, 2018 | 4 | 2018 |
| Thermal stress in encapsulated electronic packages I Kovtun, S Petrashchuk, J Boiko 2019 International Conference on Information and Telecommunication …, 2019 | 3 | 2019 |
| Non-destructive strength and hermetic seal diagnostics and prediction of super-high-frequency electronic modules JM Boiko, VP Royzman, II Kovtun, SA Petrashchuk Proc, 93-94, 2017 | 3 | 2017 |
Юлій Миколайович Бойко | Juliy Boik...Хмельницький національний університет (Khmelnytskyi National University)Підтверджена електронна адреса в khmnu.edu.ua
