Effects of the strain transmission from the main board to the installed electronic components I Kovtun, J Boiko, S Petrashchuk, G Baurienė, K Pilkauskas Mechanika 22 (6), 489-494, 2016 | 28 | 2016 |
Nondestructive strength diagnostics of solder joints on printed circuit boards I Kovtun, J Boiko, S Petrashchuk 2017 International conference on information and telecommunication …, 2017 | 27 | 2017 |
Productivity of telecommunication systems with modified signal-code constructions J Boiko, I Kovtun, S Petrashchuk 2017 4th International Scientific-Practical Conference Problems of …, 2017 | 23 | 2017 |
Theory and practice of vibration analysis in electronic packages I Kovtun, J Boiko, S Petrashchuk, T Kałaczyński MATEC Web of Conferences 182, 02015, 2018 | 22 | 2018 |
Quality assessment of synchronization devices in telecommunication J Boiko, O Eromenko, I Kovtun, S Petrashchuk 2019 IEEE 39th International Conference on Electronics and Nanotechnology …, 2019 | 17 | 2019 |
Vibration transmission in electronic packages having structurally complex design J Boiko, I Kovtun, S Petrashchuk 2017 IEEE First Ukraine Conference on Electrical and Computer Engineering …, 2017 | 17 | 2017 |
Improving Reliability of Machine Units and Details by Acoustic Emission Diagnosing RI Silin, VP Royzman, II Kovtun, AV Goroshko 第十一届 IFTOMM 世界大会论文集, 2004 | 9 | 2004 |
Mathematical model for dynamic force analysis of printed circuit boards II Kovtun, JM Boiko, SA Petrashchuk Journal of Physics: Conference Series 1921 (1), 012120, 2021 | 8 | 2021 |
Reliability Improvement of Printed Circuit Boards by Designing Methods for Solder Joint Technical Diagnostics with Application of Acoustic Emission Method II Kovtun, JM Boiko, SA Petrashchuk Вісник Національного технічного університету України Київський політехнічний …, 2019 | 7 | 2019 |
Identification of natural frequency and form of oscillation for electronic packages subjected to vibration I Kovtun, J Boiko, S Petrashchuk 2018 IEEE 38th International Conference on Electronics and Nanotechnology …, 2018 | 6 | 2018 |
Acoustic emission application for nondestructive strength diagnostics of printed circuit boards I Kovtun, J Boiko, S Petrashchuk Вісник Хмельницького національного університету. Технічні науки, 12-17, 2018 | 6 | 2018 |
Assessing Enclosure Case Design on Excitation and Transmission of Vibration in Electronic Packages I Kovtun, J Boiko, S Petrashchuk 2019 IEEE 2nd Ukraine Conference on Electrical and Computer Engineering …, 2019 | 5 | 2019 |
Selected issues of work safety G Kalda, K Pietrucha-Urbanik, I Kovtun Oficyna Wydawnicza Politechniki Rzeszowskiej, 2015 | 4 | 2015 |
Development of methods for acoustic emission non-destructive strength diagnostics of components and units/II Kovtun, VP Royzman I Kovtun Scientific collection of the National Academy of the State Border Guard …, 2015 | 4 | 2015 |
Software and hardware complex of acoustic emission VP Roizman, II Kovtun Measurement and computation technique in technological processes …, 1997 | 4 | 1997 |
Methods for Vibration Reduction in Enclosed Electronic Packages I Kovtun, J Boiko, S Petrashchuk, T Kałaczyński MATEC Web of Conferences 302, 01008, 2019 | 3 | 2019 |
Effectiveness Improvement Method for Signal Processing in Optical Telecommunication J Boiko, O Eromenko, I Kovtun, S Petrashchuk 2018 International Scientific-Practical Conference Problems of …, 2018 | 3 | 2018 |
Nondestructive hermetic seal diagnostics and prediction method for super-high-frequency modules I Kovtun, J Boiko, S Petrashchuk 2018 14th International Conference on Advanced Trends in Radioelecrtronics …, 2018 | 3 | 2018 |
5.1. Acoustic emission diagnostics of solder joints on printed circuit boards I Kovtun, V Royzman, A Voznyak Quality and Reliability of Technical Systems: Theory and Practice, 214, 2018 | 3 | 2018 |
Calculation of mechanical stresses in adjoint system of electronic component and compound and strength assessment V Royzman, S Petrashchuk, I Kovtun, A Lokoshchenko Journal of Vibroengineering 15 (1), 65-71, 2013 | 3 | 2013 |