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Steven J. Hillenius
Steven J. Hillenius
AT&T Bell Laboratories, Semiconductor Research Corporation
Подтвержден адрес электронной почты в домене ieee.org
Название
Процитировано
Процитировано
Год
Liquid water as a lone‐pair amorphous semiconductor
F Williams, SP Varma, S Hillenius
The Journal of Chemical Physics 64 (4), 1549-1554, 1976
2491976
The vertical replacement-gate (VRG) MOSFET: A 50-nm vertical MOSFET with lithography-independent gate length
JM Hergenrother, D Monroe, FP Klemens, A Komblit, GR Weber, ...
International Electron Devices Meeting 1999. Technical Digest (Cat. No …, 1999
2111999
Explanation of reverse short channel effect by defect gradients
CS Rafferty, HH Vuong, SA Eshraghi, MD Giles, MR Pinto, SJ Hillenius
Proceedings of IEEE International Electron Devices Meeting, 311-314, 1993
1231993
Low leakage, ultra-thin gate oxides for extremely high performance sub-100 nm nMOSFETs
G Timp, A Agarwal, FH Baumann, T Boone, M Buonanno, R Cirelli, ...
International Electron Devices Meeting. IEDM Technical Digest, 930-932, 1997
1181997
Anomalous CV characteristics of implanted poly MOS structure in n/sup+//p/sup+/dual-gate CMOS technology
CY Lu, JM Sung, HC Kirsch, SJ Hillenius, TE Smith, L Manchanda
IEEE Electron Device Letters 10 (5), 192-194, 1989
971989
A symmetric submicron CMOS technology
SJ Hillenius, R Liu, GE Georgiou, RL Field, DS Williams, A Kornblit, ...
1986 International Electron Devices Meeting, 252-255, 1986
851986
Fluorine effect on boron diffusion of p/sup+/gate devices (MOSFETs)
JM Sung, CY Lu, ML Chen, SJ Hillenius, WS Lindenberger, L Manchanda, ...
International Technical Digest on Electron Devices Meeting, 447-450, 1989
841989
Dimensional crossover in the superconducting intercalated layer compound -Ta
RV Coleman, GK Eiserman, SJ Hillenius, AT Mitchell, JL Vicent
Physical Review B 27 (1), 125, 1983
811983
A novel, aerosol-nanocrystal floating-gate device for non-volatile memory applications
J De Blauwe, M Ostraat, ML Green, G Weber, T Sorsch, A Kerber, ...
International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No …, 2000
692000
Multigigahertz CMOS dual-modulus prescaler IC
HI Cong, JM Andrews, DM Boulin, SC Fang, SJ Hillenius, JA Michejda
IEEE journal of solid-state circuits 23 (5), 1189-1194, 1988
681988
Metal-insulator transition and charge-density wave in
SJ Hillenius, RV Coleman, RM Fleming, RJ Cava
Physical Review B 23 (4), 1567, 1981
671981
50 nm vertical replacement-gate (VRG) nMOSFETs with ALD HfO2 and Al2O3 gate dielectrics
JM Hergenrother, GD Wilk, T Nigam, FP Klemens, D Monroe, ...
Technical Digest-International Electron Devices Meeting, 51-54, 2001
642001
Process limitation and device design tradeoffs of self-aligned TiSi/sub 2/junction formation in submicrometer CMOS devices
CY Lu, JJ Sung, R Liu, NS Tsai, R Sing, SJ Hillenius, HC Kirsch
IEEE transactions on electron devices 38 (2), 246-254, 1991
631991
Improved film growth and flatband voltage control of ALD HfO/sub 2/and Hf-Al-O with n/sup+/poly-Si gates using chemical oxides and optimized post-annealing
GD Wilk, ML Green, MY Ho, BW Busch, TW Sorsch, FP Klemens, B Brijs, ...
2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No …, 2002
562002
Light nitrogen implant for preparing thin-gate oxides
CT Liu, Y Ma, J Becerro, S Nakahara, DJ Eaglesham, SJ Hillenius
IEEE Electron Device Letters 18 (3), 105-107, 1997
561997
Self-powered device
SJ Hillenius
US Patent 5,642,014, 1997
491997
A highly manufacturable corner rounding solution for 0.18/spl mu/m shallow trench isolation
CP Chang, CS Pai, FH Baumann, CT Liu, CS Rafferty, MR Pinto, EJ Lloyd, ...
International Electron Devices Meeting. IEDM Technical Digest, 661-664, 1997
481997
Self-aligned cobalt disilicide for gate and interconnection and contacts to shallow junctions
SP Murarka, DB Fraser, AK Sinha, HJ Levinstein, EJ Lloyd, R Liu, ...
IEEE transactions on electron devices 34 (10), 2108-2115, 1987
481987
A 6.75 ns 16* 16 bit multiplier in single-level-metal CMOS technology
R Sharma, AD Lopez, JA Michejda, SJ Hillenius, JM Andrews, ...
IEEE Journal of Solid-State Circuits 24 (4), 922-927, 1989
471989
Preventing boron penetration through 25-/spl Aring/gate oxides with nitrogen implant in the Si substrates
CT Liu, Y Ma, H Luftman, SJ Hillenius
IEEE Electron Device Letters 18 (5), 212-214, 1997
451997
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