| The electrothermal large-signal model of power MOS transistors for SPICE J Zarebski, K Górecki IEEE transactions on power electronics 25 (5), 1265-1274, 2009 | 88 | 2009 |
| Modelowanie, symulacja i pomiary przebiegów elektrotermicznych w elementach półprzewodnikowych i układach elektronicznych J Zarębski Wydawnictwo Uczelniane WSM, 1996 | 71 | 1996 |
| Nonlinear compact thermal model of power semiconductor devices K Górecki, J Zarebski IEEE Transactions on Components and Packaging Technologies 33 (3), 643-647, 2010 | 70 | 2010 |
| Compact thermal models of semiconductor devices: A Review K Górecki, J Zarębski, P Górecki, P Ptak International Journal of Electronics and Telecommunications 65, 2019 | 59 | 2019 |
| Parameter estimation of the electrothermal model of the ferromagnetic core K Górecki, M Rogalska, J Zarębski Microelectronics Reliability 54 (5), 978-984, 2014 | 58 | 2014 |
| Measurements of parameters of the thermal model of the IGBT module K Górecki, P Górecki, J Zarębski IEEE Transactions on Instrumentation and Measurement 68 (12), 4864-4875, 2019 | 55 | 2019 |
| Modeling the influence of selected factors on thermal resistance of semiconductor devices K Górecki, J Zarębski IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (3 …, 2013 | 52 | 2013 |
| Modeling nonisothermal characteristics of switch-mode voltage regulators K Gorecki, J Zarebski IEEE Transactions on Power Electronics 23 (4), 1848-1858, 2008 | 45 | 2008 |
| The method of a fast electrothermal transient analysis of single-inductance DC–DC converters K Górecki, J Zarębski IEEE Transactions on Power Electronics 27 (9), 4005-4012, 2012 | 40 | 2012 |
| Modeling single inductor DC–DC converters with thermal phenomena in the inductor taken into account K Detka, K Gorecki, J Zarębski IEEE Transactions on Power Electronics 32 (9), 7025-7033, 2016 | 35 | 2016 |
| A method of measuring the transient thermal impedance of monolithic bipolar switched regulators J Zarebski, K Gorecki IEEE Transactions on Components and Packaging Technologies 30 (4), 627-631, 2007 | 35 | 2007 |
| Modelling CoolMOS transistors in SPICE J Zarȩbski, K Górecki IEE Proceedings-Circuits, Devices and Systems 153 (1), 46-52, 2006 | 31 | 2006 |
| Parameters estimation of the dc electrothermal model of the bipolar transistor J Zarębski, K Górecki International Journal of Numerical Modelling: Electronic Networks, Devices …, 2002 | 30 | 2002 |
| Electrothermal analysis of the self-excited push–pull DC–DC converter K Górecki, J Zarębski Microelectronics Reliability 49 (4), 424-430, 2009 | 29 | 2009 |
| Estymacja parametrów modelu termicznego elementów półprzewodnikowych K Górecki, J Zarębski Kwartalnik Elektroniki i Telekomunikacji 52 (3), 347-360, 2006 | 29 | 2006 |
| System mikrokomputerowy do pomiaru parametrów termicznych elementów półprzewodnikowych i układów scalonych K Górecki, J Zarębski Metrology and measurement systems 8 (4), 379-396, 2001 | 28 | 2001 |
| Modelling, simulations and measurements of electrothermal characteristics in semiconductor devices and electronic circuits J Zarębski Proc. of Gdynia Maritime Academy, 1996 | 28 | 1996 |
| SPICE‐aided modelling of dc characteristics of power bipolar transistors with self‐heating taken into account J Zarębski, K Górecki International Journal of Numerical Modelling: Electronic Networks, Devices …, 2009 | 27 | 2009 |
| A method of the thermal resistance measurements of semiconductor devices with p–n junction J Zarębski, K Górecki Measurement 41 (3), 259-265, 2008 | 25 | 2008 |
| Spice-aided modelling of the UC3842 current mode PWM controller with selfheating taken into account J Zarębski, K Górecki Microelectronics Reliability 47 (7), 1145-1152, 2007 | 25 | 2007 |
