| Enhanced energy storage performance of polyethersulfone-based dielectric composite via regulating heat treatment and filling phase Y Zhang, X He, X Cong, Q Wang, H Yi, S Li, C Zhang, T Zhang, X Wang, ... Journal of Alloys and Compounds 960, 170539, 2023 | 54 | 2023 |
| Prediction of void growth and fiber volume fraction based on filament winding process mechanics Q Wang, T Li, B Wang, C Liu, Q Huang, M Ren Composite Structures 246, 112432, 2020 | 45 | 2020 |
| Multiscale numerical and experimental investigation into the evolution of process-induced residual strain/stress in 3D woven composite Q Wang, T Li, X Yang, Q Huang, B Wang, M Ren Composites Part A: Applied Science and Manufacturing 135, 105913, 2020 | 43 | 2020 |
| Microscopic residual stresses analysis and multi-objective optimization for 3D woven composites Q Wang, X Yang, H Zhao, X Zhang, G Cao, M Ren Composites Part A: Applied Science and Manufacturing 144, 106310, 2021 | 19 | 2021 |
| Prediction and compensation of process-induced distortions for L-shaped 3D woven composites Q Wang, T Li, X Yang, K Wang, B Wang, M Ren Composites Part A: Applied Science and Manufacturing 141, 106211, 2021 | 17 | 2021 |
| Study of one-dimensional cure simulation applicable conditions for thick laminates and its comparison with three-dimensional simulation M Ren, Q Wang, J Cong, X Chang Science and Engineering of Composite Materials 25 (6), 1197-1204, 2018 | 13 | 2018 |
| Buckling analysis of thin-walled metal liner of cylindrical composite overwrapped pressure vessels with depressions after autofrettage processing G Zhang, H Zhu, Q Wang, X Zhang, M Ren, S Xue, G Li Science and Engineering of Composite Materials 28 (1), 540-554, 2021 | 7 | 2021 |
| Simulating dielectric breakdown based on Maxwell’s equations with inhomogeneous conductivity Q Wang, Y Yang, M Yap, WK Chern, Z Chen 2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena …, 2022 | 3 | 2022 |
| Investigation of Biaxial Properties of CFRP with the Novel-Designed Cruciform Specimens X Zhang, H Zhu, Z Lv, X Zhao, J Wang, Q Wang Materials 15 (19), 7034, 2022 | 3 | 2022 |
| Effect of cure cycles on residual stresses in thick composites using multi-physics coupled analysis with multiple constitutive models Q Wang, X Yang, X Zhang, X Chang, M Yap, Z Chen, M Ren Materials Today Communications 32, 104094, 2022 | 3 | 2022 |
| Effect of stress/strain partition on the mechanical behavior of heterostructured laminates: a strain gradient plasticity modeling X Lu, J Zhao, Q Wang, H Ran, Q Wang, C Huang Results in Engineering 20, 101631, 2023 | 2 | 2023 |
| Degradation and Lifetime Prediction of Epoxy Composite Insulation Materials under High Relative Humidity J Ma, Y Yang, Q Wang, Y Deng, M Yap, WK Chern, JT Oh, Z Chen Polymers 15 (12), 2666, 2023 | 2 | 2023 |
| Investigations on the mechanical behavior of composite pipes considering process-induced residual stress X Yang, M Ren, Q Wang, L Luo, B Wang Engineering Fracture Mechanics 284, 109122, 2023 | 2 | 2023 |
| Electrical properties of epoxy resin after thermal aging under high humidity Y Yang, J Ma, M Yap, Q Wang, WK Chern, YSE Foo, Z Chen 2022 IEEE Conference on Electrical Insulation and Dielectric Phenomena …, 2022 | 2 | 2022 |
| Multiscale analysis and process parameters optimization of residual stress/strain of 3D woven composite Q Wang, Q Jiang, X Yang Acta Materiae Compositae Sinica 38, 1167-1176, 2021 | 2 | 2021 |
| Electrical tree modelling in dielectric polymers using a phase-field regularized cohesive zone model Q Wang, Y Deng, M Yap, Y Yang, J Ma, WK Chern, J Li, Z Chen Materials & Design 235, 112409, 2023 | 1 | 2023 |
| Modeling the Dielectric Breakdown of Nanocomposites Using a Novel Phase-Field Model Q Wang, Y Deng, J Ma, M Yap, Y Yang, WK Chern, Z Chen 2023 International Symposium on Electrical Insulating Materials (ISEIM), 01-04, 2023 | 1 | 2023 |
| Stable dielectric properties at high-temperature of Al2O3-PESU composite for energy storage application C Chen, S Wang, Z Gong, C Zhang, Y Zhang, T Zhang, X Wang, Y Zhang, ... Composites Part A: Applied Science and Manufacturing, 108109, 2024 | | 2024 |
| The combined impact of voids and thermal aging on the mechanical reliability of epoxy resin evaluated by statistical analysis Y Deng, Q Wang, J Ma, JT Oh, Z Chen Polymer Degradation and Stability 215, 110455, 2023 | | 2023 |
| Improved High Temperature Dielectric Properties of DGEBA/MHHPA/DMP-30 System with Optimizing Post-Curing Process J Li, P Guo, Y Wang, Q Wang, B Du IEEE Transactions on Dielectrics and Electrical Insulation, 2023 | | 2023 |
Tong LiDalian University of TechnologyVerified email at dlut.edu.cn
