| Physics and materials challenges for lead-free solders KN Tu, AM Gusak, M Li Journal of applied Physics 93 (3), 1335-1353, 2003 | 432 | 2003 |
| Kinetic theory of flux-driven ripening AM Gusak, KN Tu Physical Review B 66 (11), 115403, 2002 | 194 | 2002 |
| Thermomigration in SnPb composite flip chip solder joints AT Huang, AM Gusak, KN Tu, YS Lai Applied Physics Letters 88 (14), 141911, 2006 | 168 | 2006 |
| Diffusion-controlled solid state reactions: in alloys, thin films and nanosystems AM Gusak, TV Zaporozhets, YO Lyashenko, SV Kornienko, MO Pasichnyy, ... John Wiley & Sons, 2010 | 151 | 2010 |
| In situ observation of electromigration-induced void migration in dual-damascene interconnect structures AV Vairagar, SG Mhaisalkar, A Krishnamoorthy, KN Tu, AM Gusak, ... Applied physics letters 85 (13), 2502-2504, 2004 | 113 | 2004 |
| Size distribution and morphology of Cu6Sn5 scallops in wetting reaction between molten solder and copper JO Suh, KN Tu, GV Lutsenko, AM Gusak Acta Materialia 56 (5), 1075-1083, 2008 | 106 | 2008 |
| Phase diagram versus diagram of solubility: What is the difference for nanosystems? AS Shirinyan, AM Gusak, M Wautelet Acta Materialia 53 (19), 5025-5032, 2005 | 96 | 2005 |
| Kinetic analysis of the instability of hollow nanoparticles AM Gusak, TV Zaporozhets, KN Tu, U Gösele Philosophical Magazine 85 (36), 4445-4464, 2005 | 89 | 2005 |
| Ambient dissolution-recrystallization towards large-scale preparation of V2O5 nanobelts for high-energy battery applications X Rui, Y Tang, O Malyi, Y Gusak, A., Zhang, Z Niu, HT Tan, C Persson, ... NANO ENERGY, 2016 | 73 | 2016 |
| Electromigration-induced grain rotation in anisotropic conducting beta tin AT Wu, AM Gusak, KN Tu, CR Kao Applied physics letters 86 (24), 241902, 2005 | 73 | 2005 |
| Phase diagrams of decomposing nanoalloys AS Shirinyan, AM Gusak Philosophical Magazine 84 (6), 579-593, 2004 | 73 | 2004 |
| Microstructural stability of the Kirkendall plane in solid-state diffusion MJH Van Dal, AM Gusak, C Cserháti, AA Kodentsov, FJJ Van Loo Physical review letters 86 (15), 3352, 2001 | 73 | 2001 |
| Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration FY Ouyang, KN Tu, YS Lai, AM Gusak Applied Physics Letters 89 (22), 221906, 2006 | 66 | 2006 |
| Kinetics of nucleation in the concentration gradient AM Gusak, F Hodaj, AO Bogatyrev Journal of physics: Condensed matter 13 (12), 2767, 2001 | 64 | 2001 |
| Interaction between the Kirkendall effect and the inverse Kirkendall effect in nanoscale particles AM Gusak, KN Tu Acta Materialia 57 (11), 3367-3373, 2009 | 62 | 2009 |
| Spatio-temporal instabilities of the Kirkendall marker planes during interdiffusion in β'-AuZn MJH Van Dal, AM Gusak, C Cserháti, AA Kodentsov, FJJ Van Loo Philosophical magazine A 82 (5), 943-954, 2002 | 51 | 2002 |
| PECULIARITIES OF NUCLEATION IN THE FIELD OF A CONCENTRATION GRADIENT OF THE BINARY-SYSTEM AM Gusak UKRAINSKII FIZICHESKII ZHURNAL 35 (5), 725-729, 1990 | 51 | 1990 |
| Suppression of intermediate phase nucleation in binary couples with metastable solubility F Hodaj, AM Gusak Acta materialia 52 (14), 4305-4315, 2004 | 47 | 2004 |
| A simple way of describing the diffusion phase growth in cylindrical and spherical samples AM Gusak, MV Yarmolenko Journal of applied physics 73 (10), 4881-4884, 1993 | 45 | 1993 |
| Direct evidence of electromigration failure mechanism in dual-damascene Cu interconnect tree structures AV Vairagar, SG Mhaisalkar, MA Meyer, E Zschech, A Krishnamoorthy, ... Applied physics letters 87 (8), 081909, 2005 | 41 | 2005 |
Tetiana ZaporozhetsCherkasy National UniversityVerified email at phys.cdu.edu.ua
