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Andriy Gusak
Andriy Gusak
Черкасский национальный университет имени Богдана Хмельницкого,
Verified email at cdu.edu.ua - Homepage
Title
Cited by
Cited by
Year
Physics and materials challenges for lead-free solders
KN Tu, AM Gusak, M Li
Journal of applied Physics 93 (3), 1335-1353, 2003
4702003
Kinetic theory of flux-driven ripening
AM Gusak, KN Tu
Physical Review B 66 (11), 115403, 2002
2392002
Diffusion-controlled solid state reactions: in alloys, thin films and nanosystems
AM Gusak, TV Zaporozhets, YO Lyashenko, SV Kornienko, MO Pasichnyy, ...
John Wiley & Sons, 2010
2002010
Thermomigration in SnPb composite flip chip solder joints
AT Huang, AM Gusak, KN Tu, YS Lai
Applied Physics Letters 88 (14), 2006
1912006
Ambient dissolution-recrystallization towards large-scale preparation of V2O5 nanobelts for high-energy battery applications
X Rui, Y Tang, O Malyi, Y Gusak, A., Zhang, Z Niu, HT Tan, C Persson, ...
NANO ENERGY, 2016
1472016
Size distribution and morphology of Cu6Sn5 scallops in wetting reaction between molten solder and copper
JO Suh, KN Tu, GV Lutsenko, AM Gusak
Acta Materialia 56 (5), 1075-1083, 2008
1342008
In situ observation of electromigration-induced void migration in dual-damascene Cu interconnect structures
AV Vairagar, SG Mhaisalkar, A Krishnamoorthy, KN Tu, AM Gusak, ...
Applied physics letters 85 (13), 2502-2504, 2004
1292004
Kinetic analysis of the instability of hollow nanoparticles
AM Gusak, TV Zaporozhets, KN Tu, U Gösele
Philosophical Magazine 85 (36), 4445-4464, 2005
1052005
Phase diagram versus diagram of solubility: What is the difference for nanosystems?
AS Shirinyan, AM Gusak, M Wautelet
Acta Materialia 53 (19), 5025-5032, 2005
1022005
Electromigration-induced grain rotation in anisotropic conducting beta tin
AT Wu, AM Gusak, KN Tu, CR Kao
Applied physics letters 86 (24), 2005
912005
Microstructural stability of the Kirkendall plane in solid-state diffusion
MJH Van Dal, AM Gusak, C Cserháti, AA Kodentsov, FJJ Van Loo
Physical review letters 86 (15), 3352, 2001
812001
Interaction between the Kirkendall effect and the inverse Kirkendall effect in nanoscale particles
AM Gusak, KN Tu
Acta Materialia 57 (11), 3367-3373, 2009
792009
Phase diagrams of decomposing nanoalloys
AS Shirinyan, AM Gusak
Philosophical Magazine 84 (6), 579-593, 2004
712004
Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration
FY Ouyang, KN Tu, YS Lai, AM Gusak
Applied Physics Letters 89 (22), 2006
702006
Kinetics of nucleation in the concentration gradient
AM Gusak, F Hodaj, AO Bogatyrev
Journal of physics: Condensed matter 13 (12), 2767, 2001
692001
Pseudopartial wetting of WC/WC grain boundaries in cemented carbides
BB Straumal, I Konyashin, B Ries, AB Straumal, AA Mazilkin, ...
Materials Letters 147, 105-108, 2015
642015
Suppression of intermediate phase nucleation in binary couples with metastable solubility
F Hodaj, AM Gusak
Acta materialia 52 (14), 4305-4315, 2004
602004
A kinetic model of copper-to-copper direct bonding under thermal compression
KC Shie, AM Gusak, KN Tu, C Chen
Journal of Materials Research and Technology 15, 2332-2344, 2021
592021
Spatio-temporal instabilities of the Kirkendall marker planes during interdiffusion in β'-AuZn
MJH Van Dal, AM Gusak, C Cserháti, AA Kodentsov, FJJ Van Loo
Philosophical magazine A 82 (5), 943-954, 2002
582002
Extremely rapid grain growth in scallop-type Cu6Sn5 during solid–liquid interdiffusion reactions in micro-bump solder joints
AM Gusak, KN Tu, C Chen
Scripta Materialia 179, 45-48, 2020
552020
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