Cyclic expansion-extrusion (CEE): A modified counterpart of cyclic extrusion-compression (CEC) N Pardis, B Talebanpour, R Ebrahimi, S Zomorodian
Materials Science and Engineering: A 528 (25-26), 7537-7540, 2011
136 2011 A novel single pass severe plastic deformation technique: Vortex extrusion M Shahbaz, N Pardis, R Ebrahimi, B Talebanpour
Materials Science and Engineering: A 530, 469-472, 2011
76 2011 Microstructural and mechanical properties of commercially pure aluminum subjected to dual equal channel lateral extrusion B Talebanpour, R Ebrahimi, K Janghorban
Materials Science and Engineering: A 527 (1-2), 141-145, 2009
68 2009 Recrystallization and U Sahaym, B Talebanpour, S Seekins, I Dutta, P Kumar, P Borgesen
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 …, 2013
39 2013 Upper-bound analysis of dual equal channel lateral extrusion B Talebanpour, R Ebrahimi
Materials & Design 30 (5), 1484-1489, 2009
36 2009 Microstructurally adaptive constitutive relations and reliability assessment protocols for lead free solder P Borgesen, E Cotts, I Dutta
SERDP Project WP-1752 Final Report, 2015
31 2015 Microstructural evolution and some unusual effects during thermo-mechanical Cycling of Sn-Ag-Cu alloys Kumar, B Talenbanpour, U Sahaym, CH Wen, I Dutta
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 …, 2012
28 2012 Effect of Joint Scale and Processing on the Fracture of Sn-3Ag-0.5Cu Solder Joints: Application to Micro-bumps in 3D Packages ID B. Talebanpour, Z. Huang, Z. Chen
Journal of Electronic Materials, 2015
18 * 2015 Effect of composition and thermal–mechanical history on the creep behavior of Sn–Ag–Cu Solders—Part II: Model B Talebanpour, U Sahaym, I Dutta
IEEE Transactions on Device and Materials Reliability 16 (3), 326-335, 2016
8 2016 Effect of Composition and Thermal–Mechanical History on the Creep Behavior of Sn–Ag–Cu Solders—Part I: Experiments B Talebanpour, U Sahaym, I Dutta
IEEE Transactions on Device and Materials Reliability 16 (3), 318-325, 2016
5 2016 Fracture mechanisms in Sn-Ag-Cu solder micro-bumps for 3D microelectronic packages B Talebanpour, I Dutta
International Electronic Packaging Technical Conference and Exhibition 56895 …, 2015
5 2015 Effect of processing on the microstructure and fracture of solder microbumps in 3D packages Z Chen, B Talebanpour, Z Huang, P Kumar, I Dutta
Electronics Packaging Technology Conference (EPTC 2013), 2013 IEEE 15th, 534-537, 2013
2 2013 Effect of aging on impression creep behavior of Pb-free solders B Talebanpour, U Sahaym, I Dutta, P Kumar
International Electronic Packaging Technical Conference and Exhibition 55751 …, 2013
2 2013 Utilization of channel angular deformation as an alternative for direct extrusion B Talebanpour, N Pardis, M Hariri, MM Moshksar
Materials Science and Engineering: A 527 (10-11), 2492-2497, 2010
2 2010 The effect of underfill on thermal stresses on logic ASIC and its electrical performance B Talebanpour, D Link
IMAPSource Proceedings 2017 (DPC), 1-20, 2017
2017 Microstructural effects on creep and fracture mechanics of Sn-Ag-Cu solders B Talebanpour
Washington State University, 2015
2015 Microstructural Evolution in SnAgCu Solders and Effect on Constitutive Response During Creep B Talebanpour, P Kumar, Z Huang, CH Wen, I Dutta
AIP Conference Proceedings, 2012
2012 MICROSTRUCTURAL EFFECTS ON CREEP AND FRACTURE MECHANICS OF SN-AG-CU SOLDERSMICROSTRUCTURAL EFFECTS ON CREEP AND FRACTURE OF Sn-Ag-Cu SOLDERS B Talebanpour
Washington State University, 0
