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- Chengwu TaoSr. Staff Scientist, BroadcomVerified email at broadcom.com
- Mohammed IsmailProfessor and Chair, Electrical and Computer Engineering Department, Wayne State UniversityVerified email at wayne.edu
- Baher HarounTexas Instruments Senior Fellow, FIEEEVerified email at ti.com
- Yogesh RamadassSenior Director - Nanotech/MEMS/Sensors, Kilby Labs, Texas InstrumentsVerified email at ti.com
- Russell G. ByrdSenior Analog/Mixed-Signal IC Design Engineer @ Texas InstrumentsVerified email at ti.com
- Yongjie JiangAppleVerified email at apple.com
- Anant AgarwalProfessor of Electrical Engineering, Ohio State UniversityVerified email at ieee.org
- Sundar IsukapatiSUNY Polytechnic InstituteVerified email at sunypoly.edu
- Tianshi LiuThe Ohio State UniversityVerified email at osu.edu
- Adam J MorganNoMIS Power & SUNY RFVerified email at nomispower.com
- Muhammad Swilam AhmedDesign Engineer, Texas Instruments Inc.Verified email at ti.com
- Anantha ChandrakasanDean of Engineering, Massachusetts Institute of TechnologyVerified email at mit.edu
- Ahmed A AbdelmoatyThe Ohio State UniversityVerified email at osu.edu
- Manmeet SinghPhD Candidate at Ohio State UniversityVerified email at buckeyemail.osu.edu
- Bora TarSr. Design Engineer, The Ohio State UniversityVerified email at osu.edu
- Ying-Chih HsutsmcVerified email at tsmc.com
- Mohamed Wahba ElmahalawyUniversity of California, Santa BarbaraVerified email at ucsb.edu
- Henry L. (Hal) EdwardsTI Fellow at Texas InstrumentsVerified email at ti.com
- Gabriel GomezDesign Manager (DMTS) at Texas InstrumentsVerified email at ti.com
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Ayman Fayed
Professor, Electrical and Computer Engineering, The Ohio State University
Verified email at osu.edu - Homepage